Electronics Protection in Aero and Auto
Anticipating the requirements for next-generation, high-reliability electronics applications, Henkel has developed the underfill material Loctite Eccobond UF 1173. The protective underfill material, which has been formulated with health and safety top-of-mind, does not contain any reportable REACH SVHCs and is not CMR classified. According to the … Weiterlesen …









